Failure Analysis
Technology Solutions specializes in failure analysis for electronic components and printed circuits boards, which include:
- DFM analyze (Design For Manufacturing).
- DFA analyze (Design For Assembly).
- Metallurgic cross section.
- De capsulation of components.
- SEM / EDS.
- XRF, X-Ray.
- Acoustic Microscope.
- Environmental tests.
Contact Details
- 6 Odem St. Petach Tikva P.O Box 7295, Israel 4934829
- +972.3.648.6502, +972.3.644.8384 (office)
- +972.52.246.0105 (URGENT)
- +972.3.649.2957 (fax)
- nahum@n-es.co.il
- Find us on map